Investigation of the LIGA process to fabricate microchannel plates
Investigation of the LIGA process to fabricate microchannel plates
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研究 LIGA 工艺制造微通道板
DOI：
10.1109/sensor.1997.613734
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发表时间：
1997
期刊：
影响因子：
--
通讯作者：
D. Beebe
中科院分区：
文献类型：
--
作者：
R. Liu;M. Vasile;J. Goettert;D. Beebe
本文介绍了发展的微通道板原型的纵横比为20：1和各种微通道的几何形状。LIGA工艺用于制造高度高达150 /spl mu/m的具有平坦化表面的镍模具。开发了旋涂玻璃的新应用，以在Ni模具中获得玻璃结构。使用反向电镀来去除Ni模具并释放高度大于100 /spl μ/m的玻璃结构。
This paper describes the development of microchannel plate prototypes with aspect ratios of 20:1 and a variety of microchannel geometries. The LIGA process is utilized to fabricate nickel molds up to 150 /spl mu/m in height with planarized surfaces. A novel application of spin-on glass is developed to obtain glass structures in Ni molds. A reverse electroplating is used to remove the Ni mold and release the glass structures with height of more than 100 /spl mu/m.