Thermal conductivity of silicon nanocrystals and polystyrene nanocomposite thin films
Thermal conductivity of silicon nanocrystals and polystyrene nanocomposite thin films
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DOI：
10.1088/0022-3727/49/36/365303
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发表时间：
2016-09-14
影响因子：
3.4
通讯作者：
Nozaki, Tomohiro
中科院分区：
文献类型：
--
作者：
Juangsa, Firman Bagja;Muroya, Yoshiki;Nozaki, Tomohiro
硅纳米晶体（SiNC）以其尺寸依赖的光学和电子性质而闻名;它们还具有低但可控的热性质的潜力。由于在微器件应用中需要硅基低热导率材料，所以SiNC可以用于热绝缘。本文制备了SiNCs和聚合物纳米复合材料，并对其导热性能进行了测试，包括密度和比热。将测量结果与复合材料的热导率模型进行比较，并且比较显示热导率的减小值，表明纳米结构的尺寸和存在对热导率的影响。此外，在制造过程中在室温下使用硅油墨能够实现低制造成本并保持SiNC的独特性质。
Silicon nanocrystals (SiNCs) are well known for their size-dependent optical and electronic properties; they also have the potential for low yet controllable thermal properties. As a silicon-based low-thermal conductivity material is required in microdevice applications, SiNCs can be utilized for thermal insulation. In this paper, SiNCs and polymer nanocomposites were produced, and their thermal conductivity, including the density and specific heat, was measured. Measurement results were compared with thermal conductivity models for composite materials, and the comparison shows a decreasing value of the thermal conductivity, indicating the effect of the size and presence of the nanostructure on the thermal conductivity. Moreover, employing silicon inks at room temperature during the fabrication process enables a low cost of fabrication and preserves the unique properties of SiNCs.