ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints

ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints
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DOI：
10.1109/access.2019.2959324
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发表时间：
2019-12
期刊：
IEEE Access
影响因子：
3.9
通讯作者：
Guanghua Wu;Meixian Jiang;D. Das;M. Pecht
Guanghua Wu;Meixian Jiang;D. Das;M. Pecht
中科院分区：
计算机科学3区
文献类型：
--
作者：
Guanghua Wu;Meixian Jiang;D. Das;M. Pecht

文献摘要

相似文献

本文提出了一种优化固化工艺，以实现和保持各向异性导电胶（ACA）倒装芯片互连的剪切强度。首先提出了ACA的固化动力学，然后建立了固化温度T与固化时间t之间的固化度关系式。然后报告了不同固化度状态对界面剪切强度的影响，包括湿热老化前后固化度对剪切强度的影响。
This paper presents an optimized curing process for the shear strength achievement and retention for anisotropic conductive adhesive (ACA) flip-chip interconnections. The curing kinetics of ACA is first presented and then a curing degree $(\alpha)$ relationship between curing temperature $T$ and curing time $t$ is established. The influence of different curing degree states on the interfacial shear strength is then reported, including the effect of degree of curing on shear strength both before and after hygro-thermal aging.