Polished coupler and resonator fabrication
Polished coupler and resonator fabrication
复制标题
抛光耦合器和谐振器制造
DOI：
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发表时间：
1993
期刊：
影响因子：
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通讯作者：
R. Sutherland
中科院分区：
文献类型：
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作者：
R. Dahlgren;R. Sutherland
抛光耦合器技术已经为原型和试验板应用开发了几个利基市场，特别是对于双折射光纤。应用包括可变分光比耦合器、超低损耗器件、谐振环和谐振腔以及基于渐逝场的器件。本文将讨论抛光耦合器的工艺，包括耦合器基板的制备，主轴对准，光纤到槽的粘合，和基板抛光。将描述耦合器组件，包括可调节的、粘合剂结合的、光学接触结合（OCB）的设计，以及谐振器组件。数据从几个拼接和无拼接谐振器，包括单本征态偏振，偏振旋转，和高精细设备。
Polished coupler technology has developed several niches for prototype and breadboard applications, particularly for birefringent fiber. Applications include variable splitting ratio couplers, ultralow-loss devices, resonant rings and cavities, and evanescent-field-based devices. This paper will discuss the processing of polished couplers, including coupler substrate preparation, principal axis alignment, fiber-to-groove bonding, and substrate polishing. Coupler assembly, including adjustable, adhesive-bonded, optical contact bonded (OCB) designs, and resonator assembly will be described. Data from several spliced and spliceless resonators will be presented, including single-eigenstate-of-polarization, polarization rotating, and high-finesse devices.