Characteristics of on-chip dipole antenna using diamond for intra-chip wireless interconnect
Characteristics of on-chip dipole antenna using diamond for intra-chip wireless interconnect
复制标题
使用金刚石进行片内无线互连的片上偶极子天线的特性
DOI：
10.1007/s11431-010-4245-4
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发表时间：
2011-02
影响因子：
4.6
通讯作者：
He XiaoWei
中科院分区：
文献类型：
--
作者：
Li JinWen;Zhang MinXuan;He XiaoWei
In this paper, a 2-mm long on-chip dipole antenna pair on silicon substrate is simulated to investigate the transmission characteristics. A novel technique is proposed by employing a 0.35-mm thick diamond layer between silicon substrate and heat sink to improve antenna performance. The simulated transmission gain of this antenna pair with 1 mm separation on a 10-Ω cm silicon substrate increases by 9 dB at 20 GHz. A modified plane wave model involving diamond layer is also presented to explain gain improvement. Effects of dielectric variety, diamond thickness, substrate resistivity and antenna pair separation on transmission gain have been studied. The results indicate that thinner diamond layer along with high resistivity substrate is preferred. Our method makes integrated dipole antennas well suitable for intra-chip wireless interconnection which is known as a future solution to replace critical wiring interconnection.
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DOI：
10.1109/aps.2005.1551372
发表时间：
2005-07
期刊：
2005 IEEE Antennas and Propagation Society International Symposium
影响因子：
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通讯作者：
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DOI：
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发表时间：
2007
期刊：
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影响因子：
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DOI：
10.1109/melcon.2008.4618470
发表时间：
2008-05
期刊：
MELECON 2008 - The 14th IEEE Mediterranean Electrotechnical Conference
影响因子：
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