Investigation of mechanical force acting on the surface modified-substrate layer area during the chemical-mechanical micro-grinding of monocrystalline silicon
Investigation of mechanical force acting on the surface modified-substrate layer area during the chemical-mechanical micro-grinding of monocrystalline silicon
复制标题
单晶硅化学机械微研磨过程中作用于表面改性基底层区域的机械力研究
DOI：
10.1016/j.ijmecsci.2022.107482
复制
发表时间：
2022-07-14
影响因子：
7.3
通讯作者：
Ibrahim, Ahmed Mohamed Mahmoud
中科院分区：
文献类型：
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作者：
Li, Wei;Jiao, Yi;Ibrahim, Ahmed Mohamed Mahmoud
对于太阳能电池等许多先进应用，单晶硅组件的应用和需求越来越迫切。化学机械微细磨削是加工此类零件的有效方法之一。然而，单晶硅化学机械微研磨的理论尚未完全建立，材料去除机理尚不清楚。本文采用催化改性的方法对单晶表面进行改性，形成改性基底层区域。提出了一种基于绿色函数的基体改性区在法向力和切向力作用下的受力分析模型。利用纳米压痕、XPS和拉曼光谱对理论模型进行了验证，并对单晶硅的相变过程进行了探索。结果表明，所建立的力学模型能够较好地预测单晶硅材料表面改性层与基底层界面处的应力分布。此外，可以获得在负载下进行了表面化学改性的单晶硅材料的表面的内部应力分布。因此，本论文为单晶硅化学机械微研磨工艺的优化提供了理论依据。
The application and demand of monocrystalline silicon components are becoming more and more urgent for many advanced applications like solar cells. Chemical-mechanical micro-grinding is one of the effective methods for processing such components. However, the theory of chemical-mechanical micro-grinding of monocrystalline silicon has not been fully established, and the mechanism of material removal is still unclear. In this paper, the monocrystalline surface is modified by catalytic modification, resulting in a modified-substrate layer region. A model is proposed to study and analyze force conditions based on Green's function for modified-substrate layer region under the action of normal force and tangential force. The nanoindentation, XPS, and Raman spectroscopy have been done to verify the theoretical model and explore the phase change process of monocrystalline silicon. The results showed that the established mechanical model can predict the stress distribution at the interface between the surface modification layer of the monocrystalline silicon material and the substrate layer. Furthermore, the internal stress distribution of the surface of the monocrystalline silicon material that has undergone surface chemical modification under load can be obtained. Therefore, the recent paper provides a theoretical basis for the optimization of the process of chemical-mechanical micro-grinding of monocrystalline silicon.