Issues in the replacement of lead-bearing solders
Issues in the replacement of lead-bearing solders
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DOI：
10.1007/bf03222374
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发表时间：
1993-07
期刊：
影响因子：
2.6
通讯作者：
P. Vianco;D. Frear
中科院分区：
文献类型：
--
作者：
P. Vianco;D. Frear
软焊料，特别是含铅软焊料的使用可追溯到近5,000年前。与用于密封古罗马水道的材料类似的焊料现在是制造高速计算机组件的重要组成部分。这一历史证明了软焊料的技术多功能性，特别是含铅的焊料合金。然而，长期接触铅对健康的影响也已被记录在案;正在考虑采取措施限制工作场所和间接通过环境的人体接触。无铅焊料能否成功应用于未来的电子产品，将在很大程度上取决于其可焊性，可焊性可通过测试程序进行评估，如粘度计/润湿平衡技术和毛细管流动测试。
The use of soft solders, particularly those containing lead, dates back nearly 5,000 years. Solders similar to the materials used to seal the aqueducts of ancient Rome are now an important building block in the manufacture of high-speed computer assemblies. This history attests to the technological versatility of soft solders and, in particular, the solder alloys that contain lead. However, the health effects of prolonged exposure to lead have also been documented; measures to limit human exposure—at the work place and indirectly through the environment—are being considered. The successful introduction of lead-free solders into future electronic products will rely heavily upon their solderability, which can be evaluated by test procedures such as the meniscometer/wetting balance technique and the capillary flow test.