3D-Printable Dielectric Transmitarray With Enhanced Bandwidth at Millimeter-Waves

3D-Printable Dielectric Transmitarray With Enhanced Bandwidth at Millimeter-Waves
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DOI:
10.1109/access.2018.2865353
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发表时间:
2018-01-01
期刊:
影响因子:
3.9
通讯作者:
Dassano, Gianluca
Dassano, Gianluca
中科院分区:
计算机科学3区
文献类型:
--
作者:
Massaccesi, Andrea;Pirinoli, Paola;Dassano, Gianluca

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在本文中,提出了一种三层介电结构作为创新单元元件,用于具有增强带宽的发射阵列(TA)天线。它由一个具有不同尺寸方孔的中心层组成,用于补偿入射场的相位,并位于另外两个具有线性锥形方孔的相同层之间,充当匹配电路。这里给出的数值和实验结果证明了该晶胞的有效性。第一步,设计并仿真三个尺寸不断增加的不同 TA:它们的 1 dB 增益带宽(以 30 GHz 为中心)从尺寸为 10 lambda(0) x 10 lambda(0) 的最小配置的 30.9% 到 20 lambda(0) x 20 lambda(0) TA 的 17.5%。然后设计一个稍微修改过的单元,目的是通过增材制造 (AM) 技术实现原型。尺寸为 15.6 lambda(0) x 15.6 lambda(0) 的 3D 打印电介质 TA 已制造出来并进行了实验表征。测量的原型显示出优异的性能,实现了 21.5% 的 1dB 增益带宽:这些结果证明了所引入的单元的增强功能,并证明了 AM 技术的 TA 可行性。
In this paper, a three-layer dielectric structure is presented as innovative unit-cell element for transmitarray (TA) antennas with enhanced bandwidth. It consists of a central layer, with a varying size square hole, used to compensate the phase of the incident field and located between two other identical layers with linearly tapered square holes, acting as matching circuits. The effectiveness of this unit-cell is demonstrated by the numerical and the experimental results here presented. As a first step, three different TAs with increasing size are designed and simulated: their 1-dB gain bandwidth, centered at 30 GHz, varies from the 30.9% of the smallest configuration, having size of 10 lambda(0) x 10 lambda(0), to the 17.5% of the 20 lambda(0) x 20 lambda(0) TA. A slightly modified unit-cell is then designed, with the aim of realizing a prototype with an additive manufacturing (AM) technique. A 3D-printed dielectric TA with a size of 15.6 lambda(0) x 15.6 lambda(0) has been manufactured and experimentally characterized. The measured prototype shows excellent performances, achieving a 1-dB gain bandwidth of 21.5%: these results prove the enhanced features of the introduced unit-cell and demonstrate the TA feasibility with AM techniques.