Phase-field modeling for electrodeposition process
Phase-field modeling for electrodeposition process
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DOI：
10.1016/j.stam.2007.08.001
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发表时间：
2007-01
影响因子：
5.5
通讯作者：
Y. Shibuta;Yoshinao Okajima;Toshio Suzuki
中科院分区：
文献类型：
--
作者：
Y. Shibuta;Yoshinao Okajima;Toshio Suzuki
从金兹堡-朗道自由能泛函的变化出发，提出了一种新的电化学过程相场模型，其中阳离子由静电势和热力学势耦合驱动。利用该模型，采用相场模拟方法对硫酸铜溶液中铜的电沉积过程进行了研究。在一维系统中，研究了电极生长速度与外加电压的关系。然后，利用二维系统研究了镀层的形态转变随外加电压和电解质中铜离子组成比的变化。在低电压下观察到细而密的树枝。随着组成比的降低，树枝的形状变得更加复杂。
A novel phase-field model for electrochemical processes, in which cations were driven by an electrostatic potential coupled with a thermodynamic potential, was formulated from a variation of the Ginzburg–Landau free-energy functional. Using this model, an electrodeposition process of copper deposits from copper-sulfate solution was studied using a phase-field simulation. The dependence of the growth velocity of the electrode on the applied voltage was examined in a one-dimensional system. Then, the morphological transition of the electrodeposits as functions of the applied voltage and the composition ratio of copper ion in electrolyte was examined using a two-dimensional system. Thin and dense branches were observed at a low applied voltage. The shape of the branches became more complicated as the composition ratio was lowered.