Electrically insulating, layer structured SiR/GNPs/BN thermal management materials with enhanced thermal conductivity and breakdown voltage
Electrically insulating, layer structured SiR/GNPs/BN thermal management materials with enhanced thermal conductivity and breakdown voltage
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DOI：
10.1016/j.compscitech.2018.08.039
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发表时间：
2018-10-20
影响因子：
9.1
通讯作者：
Yang, Wei
中科院分区：
文献类型：
--
作者：
Feng, Chang-Ping;Wan, Shen-Shen;Yang, Wei
通过整合氮化硼（BN，电绝缘）和石墨烯纳米片（GNP，高导热性）作为填料的优点，通过简单和可扩展的策略实现了层结构的高性能热管理材料。在17.88体积%的填料填充量下，实现了出色的热导率（TC）（8.45 W m（-1）K-1）、优异的电绝缘性（击穿电压类似于5.33 kV/mm;体积电阻类似于10（12）Ω cm）和上级的电磁界面屏蔽性能，这是已报道的电绝缘聚合物基材料中的最高值。此外，机械性能和硬度也在相当好的范围内。因此，为大规模生产上级热管理材料提供了一种有前景的方法。
Layer structured high-performance thermal management materials via integrating the advantages of boron nitride (BN, electrically insulating) and graphene nanoplatelets (GNPs, highly thermally conductive) as fillers were realized by a facile and scalable strategy. Outstanding thermal conductivity (TC) of 8.45 W m(-1) K-1, the highest value among reported electrically insulating polymer-based materials, excellent electrical insulation (breakdown voltage similar to 5.33 kV/mm; volume resistance similar to 10(12)Omega cm) and superior electromagnetic interface shielding performance are achieved at a filler loading of 17.88 vol%. Moreover, the mechanical properties and hardness are also in quite good range. Thus, a promising method is provided for large scale production of superior thermal management materials.