Application of Wide-Band Material Characterization Methods to Printable Electronics

Application of Wide-Band Material Characterization Methods to Printable Electronics
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宽带材料表征方法在可印刷电子产品中的应用

DOI：
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发表时间：
2010
期刊：
IEEE transactions on electronics packaging manufacturing (Print)
影响因子：
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通讯作者：
H. Jantunen
H. Jantunen
中科院分区：
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文献类型：
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作者：
Vesa Pynttäri;Riku M. Mäkinen;V. Palukuru;Kauko Östman;Hannu Sillanpää;T. Kanerva;T. Lepistö;J. Hagberg;H. Jantunen

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在本文中，表征方法的结果，从测试结构印刷不同的印刷参数和材料。结果表明，不同的工艺参数影响物理和电气材料性能，因此高频材料表征是该过程的重要组成部分，为设计目的提供重要信息。除了结构特性之外，还获得了纳米粒子墨水的电导率和损耗信息以及介电材料的特性。特别是，直流测量结果从1.1e7 S/m到3.7e7 S/m和高频衰减值从0.5 dB/cm到2.8 dB/cm（在10 GHz）的印刷导体实现。
In this paper, characterization methods are presented with results from test structures printed with varying printing parameters and materials. It is shown that different process parameters affect both physical and electrical material properties and hence high-frequency material characterization is a vital part of the process providing important information for design purposes. The conductivities and loss information of nanoparticle inks and properties of dielectric material are achieved in addition to structural properties. In particular, dc measurement results from 1.1e7 S/m to 3.7e7 S/m and high-frequency attenuation values from 0.5 dB/cm to 2.8 dB/cm (at 10 GHz) are achieved for printed conductors.