Microstructure evolution and mechanical properties of twinned AZ31 alloy plates at lower elevated temperature
Microstructure evolution and mechanical properties of twinned AZ31 alloy plates at lower elevated temperature
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较低高温下孪晶AZ31合金板的显微组织演变和力学性能
DOI：
10.1016/j.jallcom.2014.07.045
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发表时间：
2014-12
影响因子：
6.2
通讯作者：
Hongbiao Dong
中科院分区：
文献类型：
--
作者：
Hans Jørgen Roven;Weili Cheng;Bingshe Xu;Hongbiao Dong
AZ31合金板在室温下沿横向预轧以引入延伸孪晶。本文研究了较低高温下预先存在的孪晶对 AZ31 合金板机械性能的影响。结果表明，孪生 AZ31 合金板在较低的高温下表现出比原板更高的强度，且伸长率没有大幅降低，特别是在室温、100 °C 和 200 °C 下屈服强度分别提高了 36、30 和 21 MPa。强度的提高归因于预先存在的{10-12}孪晶界的晶粒细化。与原始 AZ31 合金板相比，孪生板在 200 °C 时表现出更明显的流动软化，这可以通过预先存在的孪晶引起的动态再结晶软化效应来解释。
The AZ31 alloy plates were pre-rolled at room temperature along the transverse direction to introduce extension twinning. The effect of pre-existing twins on the mechanical properties of AZ31 alloy plates at lower elevated temperature was investigated in the current paper. The results revealed that the twinned AZ31 alloy plates exhibited higher strength at lower elevated temperature than the as-received plates without a large reduction in elongation, especially the yield strength increased by 36, 30 and 21 MPa at room temperature, 100 °C and 200 °C, respectively. The improved strength is attributed to the grain refinement by pre-existing {10–12} twin boundaries. Compared with the as-received AZ31 alloy plates, the twinned plates exhibited more pronounced flow softening at 200 °C, which can be interpreted by the dynamic recrystallization softening effect induced by pre-existing twins.
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DOI：
10.1016/j.msea.2004.09.039
发表时间：
2005-02
影响因子：
6.4
作者：
D. Yin;Kezhao Zhang;G. Wang;W. Han
通讯作者：
D. Yin;Kezhao Zhang;G. Wang;W. Han
DOI：
10.1016/0001-6160(57)90075-5
发表时间：
1957-01-01
期刊：
ACTA METALLURGICA
影响因子：
--
作者：
REEDHILL, RE;ROBERTSON, WD
通讯作者：
ROBERTSON, WD
影响因子：
6.2
作者：
Yi, Sangbong;Brokmeier, Heinz-Guenter;Letzig, Dietmar
通讯作者：
Letzig, Dietmar
影响因子：
9.8
作者：
Lou, X. Y.;Li, M.;Wagoner, R. H.
通讯作者：
Wagoner, R. H.
镁合金AZ31在循环挤压压缩过程中的显微组织演变
影响因子：
6.2
作者：
Chen, Y. J.;Wang, Q. D.;Hjelen, J.
通讯作者：
Hjelen, J.