K.W. Lee, T. Nakamura, K. Sakuma, K.T. Park, H. Shimazutsu, N. Miyakawa, K.Y. Kim, H. Kurino, M. Koyanagi: "Development of the Three-Dimensional Integration Technology for Highly Parallel Image Processing Chip"Japanese Journal of Applied Physics. Vol. 39,
K.W. Lee, T. Nakamura, K. Sakuma, K.T. Park, H. Shimazutsu, N. Miyakawa, K.Y. Kim, H. Kurino, M. Koyanagi: "Development of the Three-Dimensional Integration Technology for Highly Parallel Image Processing Chip"Japanese Journal of Applied Physics. Vol. 39,
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