Confined distribution of conductive particles in polyvinylidene fluoride-based multilayered dielectrics: Toward high permittivity and breakdown strength
Confined distribution of conductive particles in polyvinylidene fluoride-based multilayered dielectrics: Toward high permittivity and breakdown strength
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DOI：
10.1016/j.carbon.2014.12.031
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发表时间：
2015-04
期刊：
影响因子：
10.9
通讯作者：
Jiaming Zhu;Jiabin Shen;Shaoyun Guo;H. Sue
中科院分区：
文献类型：
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作者：
Jiaming Zhu;Jiabin Shen;Shaoyun Guo;H. Sue
采用层倍增挤出法制备了聚偏氟乙烯（PVDF）基多层复合材料，该材料含有交替层的受限炭黑（CB）。对于一个给定的膜厚度，一个大的增强介电常数发生以下的CB含层的增加。当总层数达到256时，在103 Hz下的介电常数变得比串联模型预测的高3倍。还观察到由层倍增过程引起的介电损耗曲线中的频率依赖性。纯PVDF和含CB层之间的电容和电导率差异导致电荷在其界面处积聚，导致介电常数和介电损耗峰值强度增加。此外，在含有CB的层之间存在PVDF明显地改善了多层膜的击穿强度，比在类似CB负载或电导率水平下的PVDF/CB常规复合物的击穿强度高至少两个数量级。本发明的制备具有高击穿强度的高k电介质的方法将显著拓宽用于脉冲供电、高场电子学和新一代清洁能源应用的电介质材料的选择。
Polyvinylidene fluoride (PVDF)-based multilayered dielectrics containing alternating layers of confined carbon black (CB) were fabricated using a layer-multiplying extrusion. For a given film thickness, a large enhancement of dielectric permittivity occurred following the increase of CB containing layers. When the number of total layers reached 256, the permittivity at 103 Hz became 3 times higher than that predicted by the series model. A frequency dependence in the dielectric loss curves caused by the layer multiplication process was also observed. The differences in capacitance and conductivity between neat PVDF and CB containing layers resulted in charge accumulation at their interfaces, leading to an increase in the permittivity and the dielectric loss peak intensity. Furthermore, the presence of PVDF between the CB containing layers distinctly improved the breakdown strength of the multilayered films by at least two orders of magnitude higher than that of the PVDF/CB conventional composite at a similar CB loading or conductivity level. The present approach for the preparation of high-k dielectrics with high breakdown strength would significantly broaden the choices of dielectric materials for pulse powered, high field electronics and a new generation of clean energy applications.