Numerical modelling of pressure solution deformation at axisymmetric asperities under normal load
Numerical modelling of pressure solution deformation at axisymmetric asperities under normal load
复制标题
法向载荷下轴对称凹凸体压溶变形的数值模拟
DOI：
10.1144/sp284.13
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发表时间：
2007
期刊：
影响因子：
--
通讯作者：
B. Evans
中科院分区：
文献类型：
--
作者：
Y. Bernabé;B. Evans
摘要 我们开发了一种通过压解（PS）压缩粗糙体的数值模型。沿接触面的溶解速率通过以下方式确定：(1) 根据粗糙体的当前形状计算法向应力分布，以及 (2) 求解流体饱和固-固界面内的扩散方程，包括与先前确定的应力场相对应的局部溶解源项。然后可以计算出在无穷小的时间间隔内凹凸形状的变化，并根据需要重复整个过程多次。我们模拟了在不同温度和载荷下不同尺寸和形状的轴对称粗糙体的 PS 压实，并使用不同的界面扩散系数值。我们的结果表明，随着 PS 过程中接触变平和生长，初始弹性变形部分松弛，应力从接触中心转移到边缘。瞬态应力释放在较长时间内仍然很重要，并且可能强烈影响实验室实验的解释。在我们的模型中，溶解和界面扩散并不像通常假设的那样按顺序组合，因此不可能识别单个限速过程。凹凸体的收敛速度大约与接触处的平均有效应力成正比，并且以复杂的方式取决于接触半径，但对凹凸体尺寸不敏感。我们还估计了在接触边缘触发底切的条件。
Abstract We developed a numerical model of compression of asperities by pressure solution (PS). The dissolution rate along the contact was determined by (1) computing the normal stress distribution from the present shape of the asperities, and (2) solving the diffusion equation inside the fluid-saturated solid–solid interface, including local dissolution source terms corresponding to the stress field previously determined. The change in shape of the asperities during an infinitesimal time interval can then be calculated and the entire procedure repeated as many times as desired. We simulated PS compaction of axisymmetric asperities with different sizes and shapes under various temperatures and loads, and using different values of the interface diffusion coefficient. Our results show that as the contact flattens and grows during PS, the initial elastic deformation is partially relaxed and the stress transferred from the contact centre to the edge. Transient stress release remains significant during an extended period and could strongly influence the interpretation of laboratory experiments. In our model, dissolution and interface diffusion are not sequentially combined as is usually assumed, making it impossible to identify a single rate-limiting process. The convergence rate of the asperities was approximately proportional to the mean effective stress at the contact, and depended in a complex way on the contact radius, but was not sensitive to the asperity size. We also estimated the conditions under which undercutting at the contact edge is triggered.
DOI：
10.1145/1874391.187410
发表时间：
1987-02
期刊：
ACM SIGSOFT Softw. Eng. Notes
影响因子：
--
作者：
Will Tribbey
通讯作者：
Will Tribbey
影响因子：
5.3
作者：
de Meer, S;Spiers, CJ;Nakashima, S
通讯作者：
Nakashima, S
在主动压力溶液过程中电测量充满流体的晶界的扩散特性。
DOI：
--
发表时间：
2002
期刊：
Earth Planet.Sci.Lett. 200
影响因子：
--
作者：
de Meer;S.;C.J.Spiers;C.J.Peach;T.Watanabe
通讯作者：
T.Watanabe