LASER SUPPORTED ACTIVATION AND ADDITIVE METALLIZATION OF THERMOPLAS- TICS FOR 3D-MIDS
LASER SUPPORTED ACTIVATION AND ADDITIVE METALLIZATION OF THERMOPLAS- TICS FOR 3D-MIDS
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发表时间：
2001
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通讯作者：
M. Hüske;J. Kickelhain;J. Müller;G. Eßer
中科院分区：
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作者：
M. Hüske;J. Kickelhain;J. Müller;G. Eßer
电路板行业内的3d - mid（三维模具-互连设备）市场增长迅速，具有很高的未来潜力。电子元件的小型化、设计的灵活性、更合理的生产和生产步骤的减少是这一发展背后的主要推动力。在这种背景下，一种名为LPKF-LDS（激光直接结构）工艺的新技术已经被开发出来，用于制造3D-MIDs。改性热塑性塑料的表面被聚焦的激光束部分激活。在接下来的化学镀过程中，铜、镍和金被沉积在完成电路轨道的激活区域上。除了高度灵活外，超细线电路和非常小的组件也可以使用这种3D-MID生产技术。本文介绍了该系统的工艺流程和系统技术以及所取得的成果。
The market for 3D-MIDs (three-dimensional Mould-Interco nnect-Devices) within the circuit board industry grows rapidly and has high future potentials. Miniaturization of electrical componentry, design flexibility, a more rational production and the reduction of production steps are the main driving forces behind this development. On this background a new technology, the so-called LPKF-LDS (Laser Direct Structuring) process, has been developed for the manufacturing of 3D-MIDs. The surface of a modified thermoplastic is partially activated by a focussed laser beam. In a following electroless plating process copper, nickel and gold are deposited on the activated areas completing the circuit tracks. In addition to being highly flexible, ultra fine line circuits and very small assemblies are possible using this 3D-MID production technology. This paper describes the process and system technology as well as results achieved.