LATTICE PARAMETERS, DENSITIES, EXPANSION COEFFICIENTS AND PERFECTION OF STRUCTURE OF CU AND OF CU-IN ALPHA PHASE
LATTICE PARAMETERS, DENSITIES, EXPANSION COEFFICIENTS AND PERFECTION OF STRUCTURE OF CU AND OF CU-IN ALPHA PHASE
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DOI：
10.1107/s0567739469001549
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发表时间：
1969-01-01
期刊：
影响因子：
--
通讯作者：
YU, LS
中科院分区：
文献类型：
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作者：
STRAUMANIS, ME;YU, LS
光谱纯铜的晶格参数 a25 = 3.61491 Å（根据折射校正），15 至 55°C 之间的热膨胀系数 α = 14.87 × 10−6°C−1。测量的密度 d25 为 8.9314 ± 0.0002 g.cm−3 与计算值 dx = 8.9316 一致。在 α 固溶体区域中，添加 In 会增加 Cu 的晶格参数，根据 ax = 3.6149 + 0.0091x 直至 x = 10.4（x = In 原子百分比，平衡 Cu）。均质合金在 15 至 65°C 之间的热膨胀系数在固溶度极限（10.4 原子% In，从 650°C 淬火）处从 14.87（纯 Cu）增加到 17.2 × 10−6°C−1。随着In含量的增加，由于空隙的形成，实验密度变得越来越低于计算密度。冷轧后，空隙闭合，差异消失。 α相代表无结构缺陷的替代固溶体。从液态淬火的合金不显示任何微孔； 800°C 均质化后出现空隙。微孔的形成是通过凝固过程中形成的各种结晶部分的不同收缩来解释的，从而在固体合金中产生内应力。应力的消除会产生空位或微孔，这些空位或微孔在热处理时合并成空隙。
Spectroscopically pure Cu has a lattice parameter a25 = 3.61491 Å (corrected for refraction), and a thermal expansion coefficient α = 14.87 × 10−6°C−1 between 15 and 55°C. The measured density d25 is 8.9314 ± 0.0002 g.cm−3 in agreement with the calculated value dx = 8.9316. In the α solid solution region additions of In increase the lattice parameter of Cu according to ax = 3.6149 + 0.0091x up to x = 10.4 (x = atomic % In, balance Cu). The thermal expansion coefficients between 15 and 65°C of the homogeneous alloys increase from 14.87 (pure Cu) to 17.2 × 10−6°C−1 at the solid solubility limit (10.4 atomic % In, quenched from 650°C). With the increase of In content the experimental densities become increasingly lower than the calculated ones because of void formation. Upon cold rolling the voids close and the differences disappear. The α phase represents a substitutional solid solution without structural defects. Alloys quenched from the liquid state do not show any microporosity; the voids appear after homogenization at 800°C. Micropore formation is explained by differential shrinkage of the various crystalline fractions formed during solidification, giving rise to internal stresses in the solid alloy. Relief of stresses results in vacancies or micropores, which coalesce into voids upon heat treatment.