High speed imaging using a capacitive division technique
High speed imaging using a capacitive division technique
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DOI：
10.1016/j.nima.2011.12.006
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发表时间：
2012-12
影响因子：
1.4
通讯作者：
J. Lapington
中科院分区：
文献类型：
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作者：
J. Lapington
电荷划分技术是光子计数成像探测器中使用的简单概念，用于通过探测器中生成的电荷云的质心的位置来确定一维或二维事件坐标。传统的设备，如电阻阳极和楔条阳极，分别利用电阻和几何方法来实现这种技术，使他们能够实现合理的良好的空间分辨率在中等事件率使用低电子通道计数。我们描述的电容分割图像读出（C-100），一个简单的方法，实现电荷分割读出的主要性能优势，这是简单和经济的建设。C-100采用三个要素;（i）提供事件电荷定位和DC信号电流返回路径的电阻层，（ii）提供与检测器电压的电隔离并将事件瞬态信号电容耦合到第三元件的电介质衬底，（iii）在若干电荷测量节点之间划分信号的电容耦合电极阵列。纯容性信号路径具有高带宽，并为前置放大器提供低容性负载，从而实现前所未有的出色事件时间和空间分辨率组合。我们目前的模拟和实验结果表明该设备的性能优势，并讨论各种读出设计的替代方案，优化的电子和潜在的应用。
The charge division technique is a simple concept used in photon-counting imaging detectors to determine one or two-dimensional event coordinates by location of the centroid of the charge cloud generated in the detector. Traditional devices, such as the resistive anode and wedge-and-strip anode, utilize resistive and geometric methods respectively to implement this technique, enabling them to achieve reasonably good spatial resolution at moderate event rates using a low electronic channel count. We describe the Capacitive Division Image Readout (C-DIR), a simple method of implementing charge division readout with major performance advantages and which is simple and economical to construct. C-DIR utilizes three elements; (i) a resistive layer providing event charge localization and DC signal current return path, (ii) a dielectric substrate which provides electrical isolation from the detector voltages and capacitively couples the event transient signal to the third element, (iii) an array of capacitively coupled electrodes which divides the signal among several charge measurement nodes. The purely capacitive signal paths have high bandwidth and present a low capacitive load to the preamplifiers, allowing an unprecedented combination of excellent event time and spatial resolution. We present simulations and experimental results demonstrating the performance advantages of the device and discuss various readout design alternatives, optimized electronics and potential applications.