Use of organosolv lignin in phenol-formaldehyde resins for particleboard production -: I.: Organosolv lignin modified resins
Use of organosolv lignin in phenol-formaldehyde resins for particleboard production -: I.: Organosolv lignin modified resins
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DOI：
10.1016/s0143-7496(02)00058-1
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发表时间：
2002-12-01
影响因子：
3.4
通讯作者：
Özmen, N
中科院分区：
文献类型：
--
作者：
Çetin, NS;Özmen, N
本文介绍了在刨花板生产中作为胶粘剂的苯酚-甲醛树脂中用有机溶木素部分替代苯酚的工作。以不同比例的木质素取代苯酚，以有机溶木素为原料合成了木质素树脂。木质素以两种不同的方式引入到树脂中。第一种方法是将一定比例的苯酚(5-40%)直接用木质素(供应时)替换成树脂。在第二种方法中，木质素在树脂制造之前先进行酚化改性。研究了不同程度的苯酚取代度(20-30%)对木质素基树脂生产的影响。对配方树脂的物理性能进行了测试，并与商品酚醛树脂进行了比较。(C)2002爱思唯尔科学有限公司。保留所有权利。
This paper describes the work considering the potential for partially replacing phenol with organosolv lignin in phenol-formaldehyde resin used as an adhesive in the production of particleboard. Lignin-based resins were synthesised with organosolv lignin using various percentages of lignin replacement for phenol. The lignin was introduced to the resin in two different ways. The first method was the replacement of a certain percentage of phenol (5-40%) with lignin (as supplied) directly into resins. In the second method, lignin was modified by phenolation prior to resin manufacture. Different degrees of phenol substitution (20-30%) were investigated for the production of lignin-based resins. The physical properties of the formulated resins were measured and compared to commercial PF resin. (C) 2002 Elsevier Science Ltd. All rights reserved.