Material removal mechanisms in lapping and polishing
Material removal mechanisms in lapping and polishing
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DOI：
10.1016/s0007-8506(07)60207-8
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发表时间：
2003-01-01
影响因子：
4.1
通讯作者：
Mullany, BA
中科院分区：
文献类型：
--
作者：
Evans, CJ;Paul, E;Mullany, BA
抛光工艺对于诸如IC制造的高价值生产工艺至关重要。然而，人们对基本的材料去除机制知之甚少。技术产出（例如，表面光洁度、亚表面损伤、部件形状）以及研磨和抛光工艺的生产量受大量变量的影响。个别企业内部的个别流程得到了很好的控制，但似乎没有能力事先预测流程绩效。作为改进过程建模的第一步，本文回顾了研磨和抛光过程中材料去除的基本机制，并确定了需要进一步工作的关键领域。
Polishing processes are critical to high value production processes such as IC manufacturing. The fundamental material removal mechanisms, howeve, are poorly understood. Technological outputs (e.g., surface finish, sub-surface damage, part shape) and throughput of lapping and polishing processes are affected by a large number of variables. Individual processes are well controlled within individual enterprises, yet there appears to be little ability to predict process performance a priori. As a first step toward improving process modeling, this paper reviews the fundamental mechanisms of material removal in lapping and polishing processes and identifies key areas where further work is required.