Pulse-by-pulse depth profile measurement of femtosecond laser ablation on copper
Pulse-by-pulse depth profile measurement of femtosecond laser ablation on copper
复制标题
铜上飞秒激光烧蚀的逐脉冲深度轮廓测量
DOI：
10.1007/s00339-018-1694-2
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发表时间：
2018
期刊：
影响因子：
--
通讯作者：
Kobayashi Yohei
中科院分区：
文献类型：
--
作者：
Tani Shuntaro;Kobayashi Yohei
在飞秒激光脉冲辐照铜的过程中，进行了逐脉冲深度分布测量。利用三维显微镜研究了多脉冲辐照过程中烧蚀深度和表面粗糙度的变化。我们发现，激活恒速率消融需要多次脉冲照射，并且脉冲的数目取决于注量。我们得出结论：在多脉冲辐照过程中，靶材的激光脆化对决定烧蚀率起着决定性的作用。
Pulse-by-pulse depth profile measurements were performed during femtosecond laser pulse irradiation on copper. The evolution of the ablation depth and the surface roughness during multi-pulse irradiation was investigated using a three-dimensional microscope. We found that a number of pulse irradiation was required to activate constant-rate ablation and the number of pulses depended on the fluence. We conclude that laser-induced embrittlement of a target material plays a decisive role to determine the ablation rate during multiple-pulse irradiation.
影响因子：
3.2
作者：
Hirayama, Y;Obara, M
通讯作者：
Obara, M