Effect of copper addition on the glass forming ability in Pd-Si binary amorphous alloying system
Effect of copper addition on the glass forming ability in Pd-Si binary amorphous alloying system
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DOI：
10.1063/1.4986532
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发表时间：
2017-09
期刊：
影响因子：
1.6
通讯作者：
Wang Xutong;M. Zeng;N. Nollmann;G. Wilde;Tian Zhuang;Chengying Tang
中科院分区：
文献类型：
--
作者：
Wang Xutong;M. Zeng;N. Nollmann;G. Wilde;Tian Zhuang;Chengying Tang
以Pd81+xSi19-x(x=0，1，1.5，2，2.5，3，4)二元合金系列和Pd83.5-xCuxSi16.5(x=0，2，4，6，8，10，12)三元合金系列为研究对象，用X射线衍射仪和差示扫描量热仪系统地研究了铜对Pd-Si非晶合金非晶形成能力的影响。结果表明，铜的加入可以使Pd-Si合金的临界尺寸从8 mm提高到15 mm，ΔTx从18.7K提高到54.7K。测定的活化能表明，铜的加入显著提高了体系的热稳定性。Pd-Si和Pd-Cu-Si合金的GFA测量结果的不同可能与不同的晶化行为有关。增强的GFA与热力学上更稳定的液体和添加铜减少了三元合金中的原子扩散有关。
The effect of copper addition on the glass forming ability in Pd-Si amorphous alloys was systematically studied by X-ray diffraction and differential scanning calorimeter with a binary alloy series of Pd81+xSi19-x (x=0, 1, 1.5, 2, 2.5, 3, 4) and a ternary alloy series of Pd83.5-xCuxSi16.5 (x=0, 2, 4, 6, 8, 10, 12). It has been found that the critical size of the Pd-Si alloys could be improved significantly from 8mm to 15mm and ΔTx could be enhanced from 18.7 K to 54.7 K with the addition of copper. The determined activation energy demonstrates that Cu additions improve the thermal stability of the system significantly. The different results of the measured criteria to evaluate the GFA for the Pd-Si and the Pd-Cu-Si alloys may be linked to a different crystallization behavior. The enhanced GFA is linked to a more thermodynamically stable liquid and a reduction of atomic diffusion in the ternary alloy by Cu addition.