Analysis of dynamic stress intensity factors for interfacial crack near shallow circular inclusion in bi-material half-space to SH wave
Analysis of dynamic stress intensity factors for interfacial crack near shallow circular inclusion in bi-material half-space to SH wave
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DOI：
10.1007/s00707-016-1678-2
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发表时间：
2016-07
期刊：
影响因子：
2.7
通讯作者：
Junliang Yang;H. Qi
中科院分区：
文献类型：
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作者：
Junliang Yang;H. Qi
采用解析方法研究了含夹杂和界面裂纹的双材料半空间的SH波散射问题。考虑边界与圆形夹杂之间的多次散射现象，利用镜像原理建立了波场的表达式。界面裂纹是在界面连接的作用下形成的。根据位移和应力连续性条件，得到了确定连接段未知力的第一类Fredholm积分方程。最后得到了动态应力强度因子的解析表达式。在考虑裂纹长度、入射波数、夹杂缺陷和不同介质参数的情况下，给出了动态应力强度因子的数值计算结果。
An analytical approach is used to investigate the SH-wave scattering problems of the bi-material half-space including a circular inclusion embedded and an interfacial crack. Considering the multiple scattering phenomena between the boundaries and the circular inclusion, the “image” principle is used to establish the expressions of the wave field. With the aid of interfacial conjunction, the interfacial crack is constructed. According to the displacement and stress continuity conditions, the Fredholm integral equations of the first kind are obtained to determine the unknown forces attached to the linking sections. Finally, analytical expressions for dynamic stress intensity factors are obtained. The numerical results for dynamic stress intensity factors are presented graphically considering the factors of the crack length, the incident wave number, the inclusion defect and the different media parameters.