Stress Singularity Analysis of Axisymmetric Piezoelectric Bonded Structure
Stress Singularity Analysis of Axisymmetric Piezoelectric Bonded Structure
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轴对称压电粘结结构的应力奇异性分析
DOI：
10.1299/jsmea.45.363
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发表时间：
2002
期刊：
影响因子：
--
通讯作者：
Katsuhiko Watanabe
中科院分区：
文献类型：
--
作者：
Yulan Li;Y. Sato;Katsuhiko Watanabe
分析了沙漏形直边双材料粘结结构在轴对称变形下粘结边缘的应力奇异性。假定粘结材料与变形轴横向各向同性。这两种材料中的一种是压电材料，另一种是不同的压电材料或普通的弹性材料。该分析假定完全结合，并基于由三个拟调和函数组成的通解。用特征函数展开法确定奇异性。讨论了考虑和不考虑机电耦合效应时应力奇异性的差异。此外，还明确了轴对称变形与平面应变变形的区别。最后，将理论计算结果与数值计算结果进行了比较，两者吻合较好。
Stress singularities at the bond edge of a bimaterial bonded structure with hourglass-shape and straight sides under an axisymmetric deformation are analyzed. The bonded materials are assumed to be transversely isotropic to the axis of deformation. One of the two materials is piezoelectric and the other one is either a dissimilar piezoelectric or a usual elastic material. The analysis assumes perfect bonding and is based on a general solution consisting of three quasi-harmonic functions. The eigen-function expansion method is used to determine the singularities. The discussions are given for the difference of the stress singularities between the cases where the electromechanical coupling effect is considered or not. Moreover, the difference between the axisymmetric deformation and the plane strain deformation are made clear. Finally, the theoretical results are compared with the numerical ones and good agreement between them is demonstrated.