Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs
Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs
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DOI：
10.1109/isqed.2017.7918329
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发表时间：
2017-03
期刊：
影响因子：
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通讯作者：
K. Furumi;Masashi Imai;A. Kurokawa
中科院分区：
文献类型：
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作者：
K. Furumi;Masashi Imai;A. Kurokawa
三维集成电路（3D ic）的热管理正成为一个至关重要的挑战。在本文中，我们提出了新的冷却架构，使用热侧壁，芯片间板和底板（热sib架构），用于3D系统，其功耗为几十到几百W/cm2作为垂直附加。侧壁有几种类型：帽状、桥状、杆状和梳状。热sib架构可以确保散热器的热传导路径，从而消除设备中产生的大部分热量。利用三维热求解器获得的实验结果表明，采用一定结构变化的结构可以显著降低三维集成电路的最高温度，其中基本结构与仅使用散热器的传统结构相比，可以降低40%以上的温升。
Thermal management for three-dimensional integrated circuits (3D ICs) is becoming a crucial challenge. In this paper, we propose new cooling architectures using thermal sidewalls, interchip plates, and a bottom plate (thermal-SIB architectures) for 3D systems that have a power dissipation of several tens to a couple of hundred W/cm2 as a vertical addition. There are several types of sidewalls: cap, bridge, poles, and comb. The thermal-SIB architectures can secure heat conduction paths to a heat sink that removes most of the heat generated in the devices. The experimental results obtained by using a 3D thermal solver demonstrate that the proposed architectures that have some structural variations can significantly reduce the maximum temperature in a 3D IC. Specifically, the basic structure could reduce the temperature rise by over 40% compared with the conventional structure that uses only a heat sink.