Study on the finishing capability and abrasives-sapphire interaction in dry chemo-mechanical-grinding (CMG) process
Study on the finishing capability and abrasives-sapphire interaction in dry chemo-mechanical-grinding (CMG) process
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DOI：
10.1016/j.precisioneng.2018.02.007
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发表时间：
2018-04-01
影响因子：
3.6
通讯作者：
Yuan, Julong
中科院分区：
文献类型：
--
作者：
Wu, Ke;Zhou, Libo;Yuan, Julong
化学机械研磨（CMG）是一种将化学反应与机械研磨相结合的固着磨粒加工方法。本文旨在研究单晶蓝宝石的干法CMG工艺的精加工能力，并了解潜在的磨料-蓝宝石相互作用。实验结果表明，采用Cr2 O3或SiO2的干法CMG工艺能够生产出具有优异表面质量和亚表面完整性的蓝宝石衬底，同时保持几何精度。X射线光电子能谱（XPS）分析表明，磨料与蓝宝石之间的相互作用称为固相反应。结果表明，与SiO2磨料相比，Cr_2O_3磨料对蓝宝石（Al_2O_3）具有更高的化学活性。结合Cr2 O3磨料提供的更高的机械效果，Cr2 O3磨料的精加工效率几乎是传统SiO2磨料的2倍。通过使用拉曼显微镜和透射电子显微镜的亚表面完整性表征揭示了Cr2 O3磨料在蓝宝石衬底的顶表面上引入浅损伤层（约100 nm），因为化学效应不足以满足与机械效应的平衡。通过SiO2磨料实现更好的机械-化学平衡，获得无损伤的亚表面。因此，除了传统的SiO2磨料外，Cr2 O3磨料是蓝宝石衬底抛光的另一种潜在的候选磨料。
Chemo-mechanical-grinding (CMG) is a fixed abrasive process by integrating both chemical reaction and mechanical grinding. This paper targets on studying the finishing ability of dry CMG processes for mono-crystal sapphire and understanding the underlying abrasives-sapphire interaction. The experiment results suggest that dry CMG processes by applying either Cr2O3 or SiO2 are able to produce sapphire substrate with an excellent surface quality and subsurface integrity, meanwhile, maintain the geometric accuracy. The underlying abrasives sapphire interaction termed as solid phase reaction is demonstrated by X-ray photoelectron spectroscope (XPS) analysis. It is suggested that Cr2O3 abrasives is more chemically active against sapphire (A1203) when compared with SiO2 abrasives. Combined with a higher mechanical effect provided by Cr2O3 abrasives, the finishing efficiency of Cr2O3 abrasives is almost 2 times higher than traditional SiO2 abrasives. The subsurface integrity characterization by using Raman microscope and transmission electron microscope reveals that Cr2O3 abrasives introduces a shallow damage layer (about 100 nm) on the top surface of sapphire substrate since the chemical effect is not sufficient enough to meet the balance with mechanical effect. With a better mechanical-chemical balance achieved by SiO2 abrasives, a damage free subsurface is obtained. Therefore, besides of traditional SiO2 abrasives, Cr2O3 abrasives is suggested to be another potential candidate for finishing sapphire substrate.