Real-Time Observation of Interface Relative Motion during Ultrasonic Wedge-Wedge Bonding Process
Real-Time Observation of Interface Relative Motion during Ultrasonic Wedge-Wedge Bonding Process
复制标题
超声波楔-楔键合过程中界面相对运动的实时观察
DOI：
10.4071/isom-2015-wp35
复制
发表时间：
2015
期刊：
影响因子：
--
通讯作者：
J. Wallaschek
中科院分区：
文献类型：
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作者：
Y. Long;J. Twiefel;Joscha Roth;J. Wallaschek
超声引线键合是微电子工业中一种主要的互连技术，自发明以来，人们对其进行了几十年的研究。由于加工时间极短，工作频率高，界面超薄，许多机理尚不清楚。研究的重点之一是焊线与基板(焊丝/基板)界面和焊线与键合工具界面(焊丝/焊具)两种界面的运动行为。在本项目中，利用高速摄像机和光学放大系统相结合的方式观测了两个界面上的运动行为。线/衬底界面的相对运动记录到的最大帧速率为350,515帧/秒，大约是键合频率的6倍。相对运动是由振动引起的往复运动和塑性变形引起的材料流动引起的。由于窗口大小的限制，线/工具界面在较低的帧速率下被观察到。通过布告。
As a predominant interconnection technique in microelectronic industry, ultrasonic wire bonding has been investigated for decades ever since its invention. Due to the extremely short process time, high operating frequency and ultrathin interfaces, many mechanisms are still unknown. One focus point of the research is the motion behaviors at the two interfaces – interface between wire & substrate (wire/substrate) and interface between wire & bonding tool (wire/tool). In this project, the motion behaviors at the two interfaces were observed by a high speed camera combined with an optical magnification system. The relative motion at the wire/substrate interface was recorded at maximum a frame rate of 350,515 fps which is approximately six times higher than the bonding frequency. The relative motion is caused by the vibration induced reciprocal motion and the plastic deformation induced material flow. The wire/tool interface was observed at lower frame rates due to the window size confinement. Through the obse...