High Temperature Deformation Behavior and Microstructure Preparation of Cu-Ni-Si-P Alloy
High Temperature Deformation Behavior and Microstructure Preparation of Cu-Ni-Si-P Alloy
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Cu-Ni-Si-P合金的高温变形行为及显微组织制备
DOI：
10.4028/www.scientific.net/msf.704-705.135
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发表时间：
2011
期刊：
影响因子：
--
通讯作者：
Ping Liu
中科院分区：
文献类型：
--
作者：
Yi Zhang;B. Tian;Ping Liu
在Gleeble-1500 D热模拟试验机上进行了Cu-Ni-Si-P合金在873-1073 K温度范围和0.01-5s-1应变速率范围内的等温压缩试验。结果表明，Cu-Ni-Si-P合金在热变形过程中发生了动态再结晶。热变形过程中的峰值应力可用双曲正弦函数描述。变形温度和应变速率对峰值应力的影响可用Zener-Hollomon参数表示。在所研究的变形温度和应变速率范围内，Cu-Ni-Si-P合金的热变形激活能为485.6kJ/ mol。建立了Cu-Ni-Si-P合金的本构方程。关键词：Cu-Ni-Si-P合金;热变形;动态再结晶; Zener-Hollomon参数
The hot deformation behavior of Cu-Ni-Si-P alloy have been investigated by means of isothermal compression tests on a Gleeble-1500D thermal mechanical simulator in the temperature ranges of 873-1073 K and strain rate ranges of 0.01-5s-1. The results show that the dynamic recryatallization occurs in Cu-Ni-Si-P alloy during hot deformation. The peak stress during hot deformation can be described by the hyperbolic sine function. The influence of deformation temperature and strain rate on the peak stress can be represented using the Zener-Hollomon parameter. Moreover, the activation energy for hot deformation of Cu-Ni-Si-P alloy is determined to be 485.6 kJ / mol within the investigated ranges of deformation temperature and strain rate. The constitutive equation of the Cu-Ni-Si-P alloy is also established. Keywords: Cu-Ni-Si-P alloy; Hot deformation; Dynamic recrystallization; Zener-Hollomon parameter.
影响因子：
6.2
作者：
Suzuki, S.;Shibutani, N.;Waseda, Y.
通讯作者：
Waseda, Y.