Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy
Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy
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DOI：
10.1016/j.matlet.2018.10.050
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发表时间：
2019-01-15
影响因子：
3
通讯作者：
Duh, Jenq-Gong
中科院分区：
文献类型：
--
作者：
Chou, Tzu-Ting;Song, Rui-Wen;Duh, Jenq-Gong
在这项研究中，镍掺杂的焊料合金导致接头具有改善的剪切性能和Sn-3.0Ag-0.5Cu-0.1Ni/Ni接头表现出最高的强度。剪切试验下的机械响应取决于焊料区的微观结构。在焊料球中掺杂少量Ni改变了焊料微观结构的演变，导致焊料区中的（Cu，Ni）（6）Sn-5沉淀，从而加强了Ni掺杂的接头。此外，焊料合金中Ni的预先存在对于触发焊料中（Cu，Ni）（6）Sn-5颗粒的沉淀是必要的。(C)2018爱思唯尔B. V.保留所有权利。
In this study, the Ni-doped solder alloy led to joints with improved shear performance and Sn-3.0Ag-0.5Cu-0.1Ni/Ni joint showed the highest strength. The mechanical response under shear testing depended on the microstructure of the solder zone. Doping minor Ni into the solder ball modified the evolution of the solder microstructure, leading to (Cu,Ni)(6)Sn-5 precipitation in the solder zone and consequently strengthening the Ni-doped joints. Additionally, the pre-existence of Ni in the solder alloy is necessary for triggering the precipitation of (Cu,Ni)(6)Sn-5 particles in solder. (C) 2018 Elsevier B.V. All rights reserved.