Deep X-ray exposure system with multistage for 3D microfabrication
Deep X-ray exposure system with multistage for 3D microfabrication
复制标题
用于 3D 微加工的多级深度 X 射线曝光系统
DOI：
10.1109/mhs.2000.903289
复制
发表时间：
2000
期刊：
影响因子：
--
通讯作者：
O. Tabata
中科院分区：
文献类型：
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作者：
H. You;N. Matsuzuka;T. Yamaji;O. Tabata
本文报道了一种新的用于实现具有可控弯曲和倾斜壁的三维微结构的深X射线曝光系统。基于紧凑型同步辐射光源，建立了专用的X射线光束线和曝光装置。它们可以在真空或氦气的暴露环境中工作。曝光装置主要由5个工作台组成，自由度多达6个，使系统具有比普通曝光装置更多的功能。基片表面除了可以在其平面内扫描外，还可以分别绕其法线和切线旋转。在PZT平台的驱动下，X射线掩模可以在其平面内相对于后面的衬底自由移动，用于控制衬底结构的壁倾斜和弯曲。该系统还具有掩模-衬底离线对准功能。该系统可实现各种3D PMMA微结构，如透镜阵列、喷嘴、管接头、锥形管、斜通道、长圆形通道、光滑接口的弯管、锥体、齿条、曲线截面的长柱等，这对于普通的X射线光刻系统是不可能的。完成了一系列的深X射线光刻实验，获得了一些有趣的PMMA三维微结构，以及刻蚀深度与曝光剂量能量之间的关系。该系统将极大地拓宽深X射线光刻和LIGA工艺的应用领域。
This paper reports a new deep X-ray exposure system to realize 3D microstructures with controllable curved and inclined walls. Based on a compact synchrotron light source, a dedicated X-ray beamline and the exposure device have been constructed. They could work in exposure environments of vacuum or helium gas. The exposure device was mainly made up of 5 stages and had as many as 6 degrees of freedom, which enabled the system to have more functions than the normal one. Besides the scan in its plane, the substrate surface could also rotate round one of its normal and tangent respectively. Driven by a PZT stage, the X-ray mask could move freely in its plan against the substrate behind, which were used to control the wall inclination and flexure of the substrate structure. The system also had off-line mask-substrate alignment function. Various 3D PMMA microstructures can be realized by the system, such as lens array, nozzles, tube connector, conical tubes, inclined channels, long circle channels, angle pipe with smooth joint, cone, gear rack, long column with curve cross-section etc., which are impossible with the normal X-ray lithography system. A series of deep X-ray lithography experiments have been completed and obtained some interesting 3D PMMA microstructures and the relationship between the etching depth and the dose energy of the exposure. It demonstrated the potential of the system, which will greatly enlarge the application fields of deep X-ray lithography and LIGA process.