Cooperation between inside and outside of TiO2: Lattice Cu+ accelerates carrier migration to the surface of metal copper for photocatalytic CO2 reduction
Cooperation between inside and outside of TiO2: Lattice Cu+ accelerates carrier migration to the surface of metal copper for photocatalytic CO2 reduction
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TiO2内外合作:晶格Cu加速载流子迁移至金属铜表面,实现光催化CO2还原
DOI:
10.1016/j.apcatb.2019.118515
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发表时间:
2020
影响因子:
22.1
通讯作者:
Li Hexing
中科院分区:
文献类型:
--
作者:
Zhu Sai;Chen Xiaofeng;Li Zhangcheng;Ye Xingyu;Liu Ying;Chen Yao;Yang Li;Chen Ming;Zhang Dieqing;Li Guisheng;Li Hexing
TiO2has been extensively used for CO2reduction while the low carrier transport efficiency still impedes its practical application. In the present work, Cu/Cu+fabricated Ti3+/TiO2(Cu/Cu+@TiO2) was prepared viain situionothermal method and acts as a highly selective catalyst for photocatalytic reduction of CO2. Abundant Cu+-O valences were formed inside the lattice of TiO2to enhance the carrier transport efficiency, and the metal copper outside on the surface are the active sites for CO2reduction. The synergistic effect between outside Cu and inside Cu+in Cu/Cu+@TiO2has dramatically increased the electron carrier density. More importantly, the photogenerated electrons in Cu/Cu+@TiO2can be 100 % utilized for CO2reduction aided by the hydroxyl group on the surface and no H2evolution was detected. Density functional theory calculations also confirm the role of Cu+-O bridge with a higher charge density at the Cu site in the lattice of TiO2. This work will provide new insights into increasing photocatalytic efficiency for CO2reduction by traditional photocatalyst like TiO2.