The effect of interfacial thermal resistance on interface crack subjected to remote heat flux
The effect of interfacial thermal resistance on interface crack subjected to remote heat flux
复制标题
远程热流作用下界面热阻对界面裂纹的影响
DOI：
10.1007/s00033-019-1235-7
复制
发表时间：
2020
影响因子：
2
通讯作者：
Gao Cun-Fa
中科院分区：
文献类型：
--
作者：
Wang Jie;Dai Ming;Gao Cun-Fa
我们考虑平面变形中均匀远程热通量下两种不同的半无限各向同性材料之间的界面裂纹的热弹性问题。裂纹面被假定为部分热渗透的（由裂纹的部分隔热系数定义），而界面被假定为完美粘合，除了在裂纹尖端附近的界面区域引入恒定的热阻。通过积分变换方法，我们得到了整个双材料系统中热弹性场的解析解。数值算例研究了界面热阻对热应力强度因子和裂纹张开/滑动位移的影响。结果表明，I型和II型TSIF的大小以及裂纹张开位移随着界面热阻的增加而增加，而裂纹滑动位移对界面热阻的变化不敏感。
We consider the thermoelastic problem of an interface crack between two dissimilar semi-infinite isotropic materials under a uniform remote heat flux in plane deformation. The crack face is assumed to be partially thermopermeable (defined by a partial insulation coefficient of the crack), while the interface is assumed to be perfectly bonded except that a constant thermal resistance is introduced into the interfacial region near the tips of the crack. By using the integral transform method, we obtain the analytic solution for the thermoelastic field in the entire bi-material system. Numerical examples are presented to study the influence of interfacial thermal resistance on the thermal stress intensity factors and the crack opening/sliding displacements. It is shown that the magnitudes of the mode I and mode II TSIFs, as well as the crack opening displacements, increase with the increasing interfacial thermal resistance, while the crack sliding displacement is insensitive to the change of interfacial thermal resistance.