Effects of Substrate Crystallographic Orientations on Microstructure in Laser Surface-Melted Single-Crystal Superalloy: Theoretical Analysis
Effects of Substrate Crystallographic Orientations on Microstructure in Laser Surface-Melted Single-Crystal Superalloy: Theoretical Analysis
复制标题
基体晶体取向对激光表面熔化单晶高温合金显微组织的影响:理论分析
DOI:
10.1007/s40195-016-0442-x
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发表时间:
2016-06
影响因子:
3.5
通讯作者:
Hu Zhuang-Qi
中科院分区:
文献类型:
--
作者:
Wang Guo-Wei;Liang Jing-Jing;Zhou Yi-Zhou;Jin Tao;Sun Xiao-Feng;Hu Zhuang-Qi
A geometric analysis technique for crystal growth and microstructure development in single-crystal welds had been previously developed. And the effect of welding conditions on the tendency of stray grains formation during solidification was researched. In the present work, these analytical methods were further extended. Combined with an original vectorization method, a 3D Rosenthal solution was used to determine thermal conditions of the welds. Afterward, the dendrite growth orientation, the dendrite growth velocity and the thermal gradient along dendrite direction were calculated and lively plotted. Finally, the tendency of stray grains formation in the solidification front was forecasted and its distribution was presented with a 3D plot. The results indicate that substrate orientation has some impacts on the crystal growth pattern, dendrite growth velocity, distribution of thermal gradient and stray grain. Based on the research methods proposed in this work, any substrate crystallographic orientation can be studied, and predicted stray grains distribution can be visualized.
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DOI:
10.1007/bf02650147
发表时间:
1989-06
期刊:
Metallurgical Transactions A
影响因子:
--
作者:
M. Rappaz;S. David;J. Vitek;L. Boatner
通讯作者:
M. Rappaz;S. David;J. Vitek;L. Boatner
影响因子:
9.4
作者:
J. Vitek
通讯作者:
J. Vitek
DOI:
10.1201/9781420035629
发表时间:
2001-05
期刊:
--
影响因子:
--
作者:
J. Dowden
通讯作者:
J. Dowden
DOI:
10.1007/bf02672592
发表时间:
1990-06
期刊:
Metallurgical Transactions A
影响因子:
--
作者:
S. David;J. Vitek;M. Rappaz;L. Boatner
通讯作者:
S. David;J. Vitek;M. Rappaz;L. Boatner
影响因子:
3.3
作者:
J. W. Park;J. Vitek;S. Babu;S. David
通讯作者:
J. W. Park;J. Vitek;S. Babu;S. David