Effects of severe plastic deformation by ECAP on the microstructure and mechanical properties of a commercial copper alloy
Effects of severe plastic deformation by ECAP on the microstructure and mechanical properties of a commercial copper alloy
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DOI：
10.1088/2053-1591/ab4a44
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发表时间：
2019-10
影响因子：
2.3
通讯作者：
Sunil Kadiyan;B. S. Dehiya
中科院分区：
文献类型：
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作者：
Sunil Kadiyan;B. S. Dehiya
本文比较了低合金铜经等径角挤压和不同温度（室温、250 °C和450 °C）中间退火后的显微组织和力学性能的变化。使用的模具通道角度为100°，并且后角为10°。我们已经研究了机械性能的维氏硬度，极限拉伸强度（UTS），偏移屈服强度（YS），伸长率（ef），沿着的微观结构的变化，产生的纹理和由此产生的小尺寸的晶粒的变化。在250 °C下退火和路线C ECAP模具挤压的处理组合导致与其他处理相比远为上级的机械性能，同时产生微观结构的均匀性。这项工作包括使用光学显微镜，断口图像（SEM），拉伸强度，EBSD（电子背散射衍射）和X射线粉末衍射的显微组织分析。该工艺组合显示出突出的前景，退火对ECAP结果的影响对于工业和研究应用非常有用。
This work is concerned with the comparison of the microstructural and mechanical properties changes in a low alloy copper by Equal channel angular pressing and intermediate annealing at different temperatures (room temperature, at 250 °C and 450 °C after every pass). The die channel angle used was 100°, and the back angle was 10°. We have investigated the mechanical properties of Vicker’s hardness, ultimate tensile strength (UTS), offset yielding strength (YS), percentage elongation (ef), along with the microstructural changes that produce changes in texture and resultant small sizes of grains. The processing combination of annealing at 250 °C and Route-C ECAP die extrusion results in far superior mechanical properties as compared to other treatments while generating uniformity in the microstructure. This work includes the microstructural analysis using optical microscopy, fractography images (SEM), tensile strength, and EBSD (Electron Back-scattered Diffraction) and x-ray powder diffraction. The processing combination shows outstanding promise and the annealing effects on ECAP results can be highly useful for industrial and research applications.