INVERSE ANALYSES AND THEIR APPLICATIONS TO NONDESTRUCTIVE EVALUATIONS
INVERSE ANALYSES AND THEIR APPLICATIONS TO NONDESTRUCTIVE EVALUATIONS
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发表时间：
2006
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通讯作者：
S. Kubo
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作者：
S. Kubo
反问题和反分析是从输出或结果中估计输入或来源的问题，在科学和工程的各个领域受到越来越多的关注。对反问题进行了合理的分类。讨论了反问题的性质和反分析中遇到的困难。总结了求解反问题的典型反演分析方案。非破坏性评估可以被视为逆问题。作为无损评价的一个例子，裂纹和缺陷的识别从裂纹体上观察到的电位分布进行了讨论。作者和他的同事们提出了主动电位CT（计算机断层扫描）方法，其中在各种电流施加条件下的电位测量与电位分布的数值分析进行比较，用于裂纹识别。讨论了该辨识的唯一性和稳定性。文中给出了主动电位CT法在二维裂纹和三维裂纹识别中的应用实例。本文作者和他的同事们提出了利用压电薄膜的无源电势CT方法，这种方法不需要施加电流。证明了被动电位法在复合材料二维和三维裂纹和分层识别中的适用性。介绍了Ikehata最近提出的直接重建空洞和夹杂的封闭法和探针法。还讨论了与残余应力和应变估计以及利用热成像技术进行缺陷识别相关的反分析方案。
Inverse problems and inverse analyses, which deal with estimation of inputs or source from outputs or results, have been receiving increasing attention in various fields of science and engineering. A reasonable classification of the inverse problems is described. The nature of inverse problems and difficulties encountered in the inverse analyses are discussed. Typical inversion analysis schemes for solving the inverse problems are summarized. Nondestructive evaluations can be regarded as inverse problems. As an example of nondestructive evaluations the identification of cracks and defects from electric potential distributions observed on cracked bodies is discussed. The author and his coworkers proposed the active electric potential CT (computed tomography) method, in which the measurements of electric potential under various electric current application conditions are compared with numerical analyses of electric potential distributions for crack identification. The uniqueness and the stability of the identification are discussed. Examples of the applications of the active electric potential CT method to identification of two-dimensional cracks and threedimensional cracks are given. By using the piezoelectric film, the present author and his coworkers proposed the passive electric potential CT method, which did not require electric current application. The applicability of the passive electric potential method to identification of two-dimensional and three-dimensional cracks and delamination in composite materials are demonstrated. The enclosure method and the probe method proposed recently by Ikehata for direct reconstruction of voids and inclusions are introduced. Inverse analysis schemes related to the residual stress and strain estimation and the defect identification using thermography are also discussed.