Micro structuring of inorganic glass by hot embossing of coated glass wafers
Micro structuring of inorganic glass by hot embossing of coated glass wafers
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DOI：
10.1007/s00542-009-0961-8
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发表时间：
2010-04-01
影响因子：
2.1
通讯作者：
Ruessel, Christian
中科院分区：
文献类型：
--
作者：
Edelmann, Jan;Worsch, Christian;Ruessel, Christian
热压花是一种经济的玻璃结构化制造工艺。然而，该工艺受到玻璃熔体粘附在模制工具上的限制。为了防止这个问题，玻璃基板上涂有薄金属、碳和氧化物层。在当前的工作中，研究了用于压花工艺的涂层的行为和适用性。结果发现，所有涂层都显示出粘合力的明显降低和粘附温度的增加，超出了与热压印相关的范围。所研究的涂层表现出韧性，然而，在较大的伸长率下，它们倾向于开裂。实现了具有毫米和微米范围的横向几何形状的流体结构的示例。该涂层可成功地应用于模压实验中，而不会因玻璃熔体的粘附而降低压花结构的质量。压花深度与结构宽度的最大纵横比为3。
Hot embossing is an economical manufacturing process for structuring of glass. However, this process is limited by sticking of glass melts on the moulding tools. In order to prevent this problem, the glass substrate was coated with thin metal, carbon and oxide layers. In the current work, the behaviour and suitability of the coatings for the embossing process were investigated. As a result, it was found that all coatings showed a clear decrease of adhesive forces and an increase of sticking temperature out of the range relevant for hot embossing. The examined coatings behave ductile, however, under larger elongations they tend to crack. Examples of fluidic structures with lateral geometries in millimetre and micrometre range were realized. The coatings could be successfully applied in moulding experiments without reduction of quality of embossed structures by sticking of the glass melts. The largest aspect ratio of embossing depth to structural width amounted to 3.