Characterization of field-effect transistors with La2Hf2O7 and HfO2 gate dielectric layers deposited by molecular-beam epitaxy
Characterization of field-effect transistors with La2Hf2O7 and HfO2 gate dielectric layers deposited by molecular-beam epitaxy
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DOI:
10.1063/1.2163985
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发表时间:
2006-01
影响因子:
3.2
通讯作者:
Z. Rittersma;J. Hooker;G. Vellianitis;J. Locquet;C. Marchiori;M. Sousa;J. Fompeyrine;L. Pantisano;W. Deweerd;T. Schram;M. Rosmeulen;S. Gendt;A. Dimoulas
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文献类型:
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作者:
Z. Rittersma;J. Hooker;G. Vellianitis;J. Locquet;C. Marchiori;M. Sousa;J. Fompeyrine;L. Pantisano;W. Deweerd;T. Schram;M. Rosmeulen;S. Gendt;A. Dimoulas
The electrical properties of La2Hf2O7 (LHO) and HfO2 (HO) high-k dielectric layers deposited by molecular-beam epitaxy are reported. Capacitors and transistors with LHO and HO gate dielectric layers and TaN metal gate electrodes deposited using physical vapor deposition were fabricated. The (SiO2) equivalent oxide thickness (EOT), the electrical oxide thickness in inversion toxinv, and the gate leakage current density (Jg) were determined on large area metal-oxide-semiconductor capacitors and metal-oxide-semiconductor field-effect transistors. HO layers with a physical thickness tph=30A showed an EOT (toxinv) of 15.1A (19.3A) with Jg=8.1×10−6A∕cm2 at Vg=Vfb−1V. LHO layers deposited on SiON showed a minimum EOT (toxinv) of 18.7A (25A) with Jg=4×10−8A∕cm2 at Vg=Vfb−1V. The (effective) electron mobility at high E field for LHO layers was observed for a 40-A-thick LHO layer deposited on Si with μeff=147cm2∕Vs at E=1MV∕cm. For a 30-A-thick HO layer at identical field, μeff=170cm2∕Vs was found. LHO layers depos...