Additive Manufacturing of Sandwich–Structured Conductors for Applications in Flexible and Stretchable Electronics
Additive Manufacturing of Sandwich–Structured Conductors for Applications in Flexible and Stretchable Electronics
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DOI：
10.1002/adem.202100286
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发表时间：
2021-07
影响因子：
3.6
通讯作者：
Xiaowei Yu;Xiangtao Gong;Chinmoy Podder;B. Ludwig;I-Meng Chen;Wan Shou;Alexis Alvidrez;Genda Chen;Xian Huang;H. Pan
中科院分区：
文献类型：
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作者：
Xiaowei Yu;Xiangtao Gong;Chinmoy Podder;B. Ludwig;I-Meng Chen;Wan Shou;Alexis Alvidrez;Genda Chen;Xian Huang;H. Pan
在电子导电材料的加工中，增材制造方法已显示出巨大的潜力，可以替代昂贵且耗时的传统减材方法，以应用于柔性和可拉伸电子产品。本文报道了在适用基材中具有高温加工性和多功能性的高导电性、夹层结构导体的增材制造。以银纳米粒子（Ag NPs）作为电子导体和聚酰亚胺（PI）作为封装的三明治结构导体通过气溶胶印刷逐层沉积成PI/Ag/PI复合材料。 250 °C 的高退火温度有助于银层具有 1.14 × 107 S m−1 的高电子电导率，这与块体银的电导率 6.3 × 107 S m−1 处于同一数量级。高退火温度还显着改善了Ag和PI层之间的界面结合。对于柔性和可拉伸电子产品的应用，三明治结构导体可通过硫醇-环氧树脂粘合工艺转移到各种基材上，包括聚苯乙烯（PS）、聚对苯二甲酸乙二醇酯（PET）、Kapton和聚二甲基硅氧烷（PDMS）薄膜。转移到柔性和可拉伸基材上的夹层结构导体在弯曲和拉伸等变形下表现出高度保留的电子导电性。
Additive manufacturing methods have shown great potentials to substitute the costly and time‐consuming conventional subtractive methods in the processing of electronically conductive materials for applications in flexible and stretchable electronics. Herein, additive manufacturing of highly conductive, sandwich‐structured conductors with high‐temperature processibility and versatility in applicable substrates is reported. The sandwich‐structured conductors with silver nanoparticles (Ag NPs) as electronic conductors and polyimide (PI) as encapsulation are layer‐by‐layer deposited by aerosol printing into PI/Ag/PI composites. A high annealing temperature of 250 °C contributes to the high electronic conductivity of the Ag layer at 1.14 × 107 S m−1, which is in the same order of magnitude to the conductivity of bulk Ag at 6.3 × 107 S m−1. The high annealing temperature also significantly improves the interfacial bonding between the Ag and PI layers. For applications in flexible and stretchable electronics, the sandwich‐structured conductors are transferrable to various substrates through a thiol−epoxy bonding process, including polystyrene (PS), polyethylene terephthalate (PET), Kapton, and polydimethylsiloxane (PDMS) thin films. The sandwich‐structured conductors transferred to flexible and stretchable substrates exhibit highly retained electronic conductivity under deformations such as bending and stretching.