Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens
Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens
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DOI：
10.3390/met9121348
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发表时间：
2019-12-01
期刊：
影响因子：
2.9
通讯作者：
Shohji, Ikuo
中科院分区：
文献类型：
--
作者：
Kobayashi, Tatsuya;Shohji, Ikuo
Sn-Sb-Ni焊料合金有望用作功率模块中下一代功率半导体的芯片粘接材料。本文的目的是使用微型样品研究 Ni 含量对 Sn-10Sb-xNi (x = 0.05, 0.10, 0.25, 0.50) (mass%) 无铅焊料合金的显微组织、拉伸和疲劳性能的影响。 Sn-10Sb-Ni焊料合金具有Sb-Sn和Ni-Sb化合物分散在β-Sn基体中的微观结构。随着Sb和Ni含量的增加，Sb-Sn和Ni-Sb化合物分别粗化。在25℃时，Ni含量对合金拉伸性能的影响较小。在150℃和200℃时，0.1%屈服强度和拉伸强度随着Ni含量的增加而逐渐增加，在Ni含量超过0.25质量%时达到饱和。根据200℃疲劳试验，添加0.10～0.25质量％Ni的Sn-10Sb-Ni的疲劳性能优于Sn-10Sb。从实验结果来看，Ni含量为0.10-0.25%的Sn-10Sb-Ni具有优异的机械性能。
Sn-Sb-Ni solder alloy is expected to be used as a die-attach material for a next-generation power semiconductors in power module. The aim of this paper is to investigate the effects of the Ni content on microstructures, tensile, and fatigue properties of Sn-10Sb-xNi (x = 0.05, 0.10, 0.25, 0.50) (mass%) lead-free solder alloys using miniature size specimens. The Sn-10Sb-Ni solder alloys have the microstructure in which Sb-Sn and Ni-Sb compounds are dispersed in the beta-Sn matrix. As the Sb and Ni content increases, Sb-Sn and Ni-Sb compounds are coarsened, respectively. The effect of the Ni content on tensile properties of the alloy is slight at 25 degrees C. At 150 degrees C and 200 degrees C, 0.1% proof stress and tensile strength increase gradually with the Ni content increases, and saturate at the Ni amount over 0.25 mass%. According to the fatigue test at 200 degrees C, the fatigue properties of Sn-10Sb-Ni with 0.10-0.25 mass% Ni are better than that of the Sn-10Sb. From the experimental results, Sn-10Sb-Ni with 0.10-0.25 mass% Ni have superior mechanical properties.