Microstructure and mechanical properties of W/Cu vacuum diffusion bonding joints using amorphous Fe-W alloy as interlayer
Microstructure and mechanical properties of W/Cu vacuum diffusion bonding joints using amorphous Fe-W alloy as interlayer
复制标题
以非晶Fe-W合金为中间层的W/Cu真空扩散连接接头的显微组织与力学性能
DOI：
10.1016/j.vacuum.2015.01.008
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发表时间：
2015-04-01
期刊：
影响因子：
4
通讯作者：
Xu, Guiying
中科院分区：
文献类型：
--
作者：
Wang, Song;Ling, Yunhan;Xu, Guiying
W/Cu功能梯度材料（FGM）作为聚变堆的面向等离子体材料（PFM）和大功率微电子器件的热沉材料，具有广阔的应用前景。然而，W和Cu中的不混溶性质使得在不引入活性金属如铁族元素的情况下难以彼此连接。本文提出了在铜片上脉冲电沉积Fe-W非晶合金作为中间层，通过真空扩散连接实现W和Cu的连接。结果表明，在焊接温度下，Fe以高活性非晶态的形式在W和Cu中双向扩散，可提高焊接接头的结合强度，降低焊接接头的残余应力。在W/Cu界面附近形成了由Fe-W和Fe-Cu二元系之间的固溶区和各种相组成的扩散过渡区，并根据显微组织特征观察到两种不同的断裂现象。采用这种新型非晶涂层作为中间层，在950 ℃、30 MPa的载荷下加热1h的钨铜真空扩散连接接头的抗拉强度最高可达146 MPa。(C)2015爱思唯尔有限公司版权所有。
W/Cu Functionally Graded Materials (FGM) are promising materials to be used as plasma facing materials (PFM) for a fusion reactor as well as a heat sink material for high power microelectronic devices. The immiscible properties in W and Cu, however, make it difficult to join each other without introduction of active metals like iron group elements. In this paper, pulse electro-deposited Fe-W amorphous alloy forming on a copper sheet was proposed as interlayer to join W and Cu via vacuum diffusion bonding. It was found that an improvement in bonding strength and a decrease in bonding residual stresses was obtained by the bidirectional diffusion of Fe, in the form of highly active amorphous state, in Wand Cu at the weld temperature. The diffusion transition regions were formed near the W/Cu interface which is consisted of a solid solution zone and various phases between the Fe-W and Fe-Cu binary systems and two different fracture phenomena was observed on the basis of the microstructural characteristics. With the introduction of this new kind amorphous coating as interlayer, the vacuum diffusion bonding joint of W and Cu heating at 950 degrees C for an hour with a load of 30 MPa showed a maximum tensile strength of about 146 MPa. (C) 2015 Elsevier Ltd. All rights reserved.