Fabrication of a 35 GHz folded waveguide TWT circuit using rapid prototype techniques
Fabrication of a 35 GHz folded waveguide TWT circuit using rapid prototype techniques
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使用快速原型技术制造 35 GHz 折叠波导 TWT 电路
DOI：
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发表时间：
2014
期刊：
影响因子：
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通讯作者：
David Gordon
中科院分区：
文献类型：
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作者：
James P. Anderson;R. Ouedraogo;David Gordon
微制造技术通常用于构建毫米波和太赫兹真空电子器件的电路。一个具有成本效益的解决方案正在变得可用，至少对于构建用于冷测试的原型电路而言。3D打印机等快速成型机已经发展到其分辨率低于许多微波电路的波长。本文综述了这一新兴技术在真空电子器件波导器件中的应用。作者使用一种称为直接金属激光烧结（DMLS）的快速原型技术，在金属中“打印”35 GHz电路样品。两种不同材料（铝和铬钴）的电路被印刷和冷测试。试验数据与仿真结果吻合较好。
Microfabrication techniques are commonly used to build circuits for millimeter-wave and THz vacuum electron devices. A cost effective solution is becoming available, at least for building prototype circuits intended for cold-testing. Rapid prototyping machines such as 3D printers have advanced to the point that their resolution is below the wavelength of many microwave circuits. This paper reviews the application of this quickly-advancing technology towards waveguide components of vacuum electron devices. The authors use a rapid prototype technique called Direct Metal Laser Sintering (DMLS) to “print” sample 35 GHz circuits in metal. Circuits in two different materials (aluminum and chromium cobalt) are printed and cold-tested. The test data shows good agreement with simulation.