Materials analysis of fluorocarbon films for MEMS applications
Materials analysis of fluorocarbon films for MEMS applications
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用于 MEMS 应用的氟碳薄膜的材料分析
DOI：
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发表时间：
1994
期刊：
影响因子：
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通讯作者：
M. Elwenspoek
中科院分区：
文献类型：
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作者：
J. Elders;H. Jansen;M. Elwenspoek
本文介绍了氟碳（FC）薄膜的材料分析结果。碳氟化合物薄膜的性能与聚四氟乙烯（PTFE）的性能相当，聚四氟乙烯（PTFE）的商标如teflon和fluon更为人所知。PTFE的特性对于MEMS应用是理想的，并且能够为微系统提供新的设计、新的应用和新的技术处理路线。因此，FC薄膜在MEMS应用中具有巨大的潜力。此外，FC膜可以容易地通过旋涂、电子束蒸发、在常规的反应离子蚀刻器中和在等离子体增强的沉积室中使用三氟化碳等离子体来沉积，从而促进膜用于微机电结构。在反应离子蚀刻机中沉积的薄膜具有极强的耐化学性。给出了X射线光电子能谱（XPS）分析结果。
In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results are presented.