Thermal properties of dough and bakery products: A review of published data
Thermal properties of dough and bakery products: A review of published data
复制标题
面团和烘焙产品的热特性:已发表数据的回顾
DOI:
10.1016/0260-8774(89)90039-3
复制
发表时间:
1989
影响因子:
5.5
通讯作者:
C. Rask
中科院分区:
文献类型:
--
作者:
C. Rask
To date, no summary of the thermal properties of dough, bread and bakery products is available. This review is therefore an attempt to rectify this situation. The aim has not been to evaluate critically the published studies, but rather to give an overview of the literature in this field to facilitate the estimation of values for the properties of a product of known moisture content and density. The thermal properties covered are specific heat, thermal conductivity and thermal diffusivity. These are tabulated together with the moisture content and the density. The properties of dough and bread are plotted versus moisture content and density. Expressions for calculating the thermal properties are both given in the text and tabulated.