Hybrid Molecular Junctions Using Au-S and Au-π Bindings
Hybrid Molecular Junctions Using Au-S and Au-π Bindings
复制标题
使用 Au-S 和 Au-π 结合的杂化分子结
DOI：
10.1021/acs.jpcc.9b11725
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发表时间：
2020
期刊：
影响因子：
3.7
通讯作者：
M. Kiguchi
中科院分区：
文献类型：
--
作者：
S. Fujii;M. Iwane;S. Furukawa;T. Tada;T. Nishino;M. Saito;M. Kiguchi
导电分子结是未来分子尺度电子电路中非常理想的元件。在这里，我们展示了一个导电的混合分子结，由Au-S和Au−π结合使用苏曼烯衍生物与三个膦硫化物锚定基团在苏曼烯骨架的外围。利用基于扫描隧道显微镜的断裂结方法在Au电极之间制备了分子结。结中的三个锚定基团和苏曼烯主链分别形成Au-S化学键和Au−π直接键。Au-S化学键将分子固定在Au电极上，使结具有较高的机械稳定性，而Au-π直接键合则使分子与金属之间具有较大的电耦合，并使结具有较高的电子电导。本研究分析了基于杂化结合基团的导电分子结的分子设计。
Electrically conductive molecular junctions are highly desirable components for applications in future molecular-scale electronic circuits. Here, we demonstrate an electrically conductive hybrid molecular junction that consists of Au–S and Au−π bindings using a sumanene derivative with three phosphine–sulfide anchoring groups at the periphery of the sumanene backbone. The molecular junction was prepared between the Au electrodes by the scanning tunneling microscopy-based break junction method. The three anchoring groups and the sumanene backbone in the junction form the Au–S chemical bonds and Au−π direct bonds, respectively. The Au–S chemical binding immobilized the molecule on the Au electrode and provided the high mechanical stability of the junction, while the direct Au−π binding led to the large metal–molecule electric coupling and high electronic conductance of the molecular junction. This study analyzes the molecular design of the electrically conductive molecular junctions based on the hybrid binding groups.