LTCC package for high temperature applications
LTCC package for high temperature applications
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DOI：
10.1016/j.microrel.2011.02.018
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发表时间：
2011-07-01
影响因子：
1.6
通讯作者：
Dziedzic, Andrzej
中科院分区：
文献类型：
--
作者：
Nowak, Damian;Dziedzic, Andrzej
人们对能够在恶劣环境和高温下工作的传感器和电子产品的需求不断增长。应用包括石油和地热工业控制的传感器和执行器，汽车和航空航天领域的过程监控和分布式控制系统。电子设备的工艺开发和包装材料与此类包装问题密切相关。在许多情况下，在满足应用需求方面，封装与器件本身一样重要。低温共烧陶瓷（LTCC）和厚膜技术有可能结合多层结构，从而实现专业封装系统的制造。LTCC技术除了能够使用集成的无源元件、加热器、传感器、转换器等之外，还能够在层内和层之间实现容易的电或光连接。本文提出了尝试开发用于在高达300摄氏度的温度下工作的基于碳化硅（SiC）的氢传感器的可靠封装技术。进行了一些热性能模拟，并制作和研究了封装结构。该封装可保护传感器免受机械损坏，并使电气连接变得容易。此外，加热器和温度传感器允许元件的适当温度调节。介绍了集成加热器的制造工艺、基本电参数和真实的温度分布。(C)2011爱思唯尔有限公司版权所有。
There is a growing demand for sensors and electronics that can work in harsh environments and at high temperature. Applications include sensors and actuators for control in petroleum and geothermal industry, process monitoring and distributed control systems in the automotive and aerospace fields. Process development and packaging materials for electronic devices are closely connected to such packaging issues. In many cases the package is as important as the device itself in meeting the applications needs.Low temperature co-fired ceramics (LTCC) and thick-film technologies have the potential to incorporate multilayer structures, enabling fabrication of specialized packaging systems. LTCC technology enables easy electrical or optical connections within and between layers in addition to enabling use of integrated passive components, heaters, sensors, converters etc.This paper presents attempts to develop a reliable packaging technology for silicon carbide (SiC) based hydrogen sensors operating at temperatures up to 300 degrees C. Some simulations of thermal properties were carried out and package structures were made and investigated. The package protects the sensor against mechanical damage and makes possible easy electrical connections. Moreover, the heater and temperature sensors allow for proper temperature regulation of the element. The manufacturing process, basic electrical parameters of the integrated heater as well as real temperature distribution are presented. (C) 2011 Elsevier Ltd. All rights reserved.