Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices

Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices
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DOI：
10.1109/ectc.2018.00222
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发表时间：
2018-05
期刊：
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
影响因子：
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通讯作者：
S. Sahasrabudhe;S. Mokler;M. Renavikar;S. Sane;K. Byrd;Eric Brigham;O. Jin;P. Goonetilleke
S. Sahasrabudhe;S. Mokler;M. Renavikar;S. Sane;K. Byrd;Eric Brigham;O. Jin;P. Goonetilleke
中科院分区：
其他
文献类型：
--
作者：
S. Sahasrabudhe;S. Mokler;M. Renavikar;S. Sane;K. Byrd;Eric Brigham;O. Jin;P. Goonetilleke

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