Mechanical characterization of sub-micrometer thick DLC films by AFM tensile testing for surface modification in MEMS
Mechanical characterization of sub-micrometer thick DLC films by AFM tensile testing for surface modification in MEMS
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通过 AFM 拉伸测试对亚微米厚 DLC 薄膜进行机械表征，以进行 MEMS 表面改性
DOI：
10.1109/memsys.2002.984295
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发表时间：
2002
期刊：
影响因子：
--
通讯作者：
T. Tanaka
中科院分区：
文献类型：
--
作者：
Y. Isono;T. Namazu;N. Terayama;T. Tanaka
本文介绍了用于MEMS摩擦磨损保护的类金刚石（DLC）薄膜的力学性能。研制了一种原子力显微镜（AFM）下的紧凑型拉伸试验机，用于测定DLC薄膜的杨氏模量、泊松比和断裂强度。采用微米尺度单晶硅（SCS）和DLC包覆SCS （DLC/SCS）试样进行试验。采用热阴极Penning电离计（PIG）放电型等离子体增强化学气相沉积（PE-CVD）方法，在20 /spl mu/m厚的SCS样品上沉积了厚度为0.2和0.3 /spl mu/m的DLC薄膜。AFM拉伸测试和纳米压痕测试表明，DLC薄膜的杨氏模量和泊松比分别在99 ~ 112 GPa和0.36 ~ 0.46之间。
This paper describes mechanical properties of Diamond-like Carbon (DLC) films for the protection of MEMS against their friction and wear. The compact tensile tester operated in atomic force microscope (AFM) was developed in this research to evaluate Young's modulus, Poisson's ratio and fracture strength of DLC films. Single crystal silicon (SCS) and DLC coated SCS (DLC/SCS) specimens on a micrometer scale were used in the tests. The DLC films with thickness of 0.2 and 0.3 /spl mu/m were deposited on 20 /spl mu/m-thick SCS specimens by Plasma-enhanced Chemical Vapor Deposition (PE-CVD) method of the hot cathode Penning Ionization Gauge (PIG) discharge type. The AFM tensile test and nano-indentation test were revealed that Young's modulus and Poisson's ratio of the DLC films ranged from 99 GPa to 112 GPa, and from 0.36 to 0.46, respectively.