DNA-Mold Templated Assembly of Conductive Gold Nanowires
DNA-Mold Templated Assembly of Conductive Gold Nanowires
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DOI：
10.1021/acs.nanolett.8b00344
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发表时间：
2018-03-01
期刊：
影响因子：
10.8
通讯作者：
Seidel, Ralf
中科院分区：
文献类型：
--
作者：
Bayrak, Tuerkan;Helmi, Seham;Seidel, Ralf
我们介绍了一种利用DNA模板溶液制备导电金纳米线的新概念。为此，我们采用DNA纳米模具，其中化学金沉积是由特定位置的附着种子发起的。使用可编程接口，单个模具自组装成微米长的模具上层结构。在随后的内部金沉积过程中，模具壁限制了金属的生长，从而获得了直径为20-30 nm的高度均匀的纳米线。利用电子束光刻技术接触金属丝，并在4.2 K和室温之间的温度下进行电导率表征，结果表明产生了金属导线，尽管部分导线的电导率受到金颗粒之间边界的限制。使用不同的模具设计，我们的合成方案将在未来允许制造具有可编程形状的复杂金属结构。
We introduce a new concept for the solution-based fabrication of conductive gold nanowires using DNA templates. To this end, we employ DNA nanomolds, inside which electroless gold deposition is initiated by site-specific attached seeds. Using programmable interfaces, individual molds self-assemble into micrometer-long mold superstructures. During subsequent internal gold deposition, the mold walls constrain the metal growth, such that highly homogeneous nanowires with 20-30 nm diameters are obtained. Wire contacting using electron-beam lithography and electrical conductance characterization at temperatures between 4.2 K and room temperature demonstrate that metallic conducting wires were produced, although for part of the wires, the conductance is limited by boundaries between gold grains. Using different mold designs, our synthesis scheme will, in the future, allow the fabrication of complex metal structures with programmable shapes.