Hybrid integration of chipscale photonic devices using accurate transfer printing methods
Hybrid integration of chipscale photonic devices using accurate transfer printing methods
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使用精确的转移印刷方法混合集成芯片级光子器件
DOI：
10.1063/5.0121567
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发表时间：
2022-12
影响因子：
15
通讯作者：
J. Smith;D. Jevtics;B. Guilhabert;M. Dawson;M. J. Strain
中科院分区：
文献类型：
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作者：
J. Smith;D. Jevtics;B. Guilhabert;M. Dawson;M. J. Strain
转移印刷正被广泛采用作为用于光子和电子器件的混合集成的后端工艺。膜组件的集成，微米级的足迹和亚微米波导尺寸，对工艺提出了严格的性能要求。在这篇综述中，我们提出了集成光子学应用的转移印刷的概述，包括材料和制造工艺的考虑，有效的光耦合方法，和高精度层间对准。我们展示了最先进的集成演示，涵盖光源和探测器、量子发射器、传感器和光机械器件。最后，我们展望了在晶圆级密集多材料集成所需的技术的未来发展。
Transfer printing is becoming widely adopted as a back-end process for the hybrid integration of photonic and electronic devices. Integration of membrane components, with micrometer-scale footprints and sub-micron waveguide dimensions, imposes strict performance requirements on the process. In this review, we present an overview of transfer printing for integrated photonics applications, covering materials and fabrication process considerations, methods for efficient optical coupling, and high-accuracy inter-layer alignment. We present state-of-the-art integration demonstrations covering optical sources and detectors, quantum emitters, sensors, and opto-mechanical devices. Finally, we look toward future developments in the technology that will be required for dense multi-materials integration at wafer scales.