Disinfection and sterilization in healthcare facilities
Disinfection and sterilization in healthcare facilities
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医疗机构的消毒和灭菌
DOI：
10.1021/bk-2007-0967.ch002
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发表时间：
2007
期刊：
影响因子：
--
通讯作者：
M. Favero
中科院分区：
文献类型：
--
作者：
M. Favero
有效使用适当的消毒和灭菌程序在预防医疗相关感染方面发挥着重要作用。本章的目的是描述医院和其他医疗机构中使用的消毒和灭菌策略的科学原理，重点是作为消毒剂配制的化学杀菌剂以及过去十年中开发的灭菌程序。(move用于医疗保健设施的化学杀菌剂包括醛类，例如戊二醛、邻苯二甲醛（OPA）和甲醛，过氧物，其包括过氧化氢、过乙酸和二氧化氯。多年来，医疗器械一直采用高温高压蒸汽灭菌和干热灭菌。越来越多的器械不能通过加热灭菌，必须通过低温灭菌系统灭菌或通过液体化学杀菌剂消毒。环氧乙烷气体和有限程度的甲醛蒸汽已用于热敏器械的灭菌。在过去的10年中，已经开发了许多新的低温灭菌系统，包括过氧化氢气体等离子体灭菌器和新的高水平消毒剂来处理医疗器械。这些系统在其作用模式中倾向于氧化，使用相对低浓度的灭菌剂，不留下有毒残留物，与医疗装置的材料具有优异的相容性，并且具有短的处理时间。
The effective use of proper disinfection and sterilization procedures plays a significant role in preventing healthcare associated infections. The purpose of this chapter is to describe the scientific rationale for disinfection and sterilization strategies used in hospitals and other healthcare facilities with a focus on chemical germicides formulated as disinfectants, and sterilization procedures that have been developed in the past decade. (move stentence up)Chemical germicides used in healthcare facilities include aldehydes, such as glutaraldehyde, ortho-phthaldehyde (OPA) and formaldehyde, peroxygens, which include hydrogen peroxide, peracetic acid and chlorine dioxide. Medical devices for many years have been sterilized by heat - steam autoclaving and dry heat. There are an increasing number of devices that cannot be sterilized by heat and must be sterilized by low temperature sterilization systems or disinfected by liquid chemical germicides. Ethylene oxides gas, and to a limited extent formaldehyde-steam, have been used for sterilization of heat sensitive instruments. Within the past 10 years a number of new low temperature sterilization systems, including hydrogen peroxide gas plasma sterilizers, and new high level disinfectants have been developed to process medical devices. These systems tend to be oxidative in their mode of action, use relatively low concentrations of the sterilizing agent, do not leave toxic residuals, have excellent compatibility with materials of medical devices, and have short process times.